STATUS

• Currently under development 2models and extends 6models until 2024
  • Under planning to change to CoB type from PCB Ass’y type
    • PCB Assy’s company : Mengbo Technology (China)
    • SW SP : SA6155P.LA.1.0.1
    • Under discussing the manufacturing site adding internally (China  China and Korea)
• Requirements 
  • OS license fee
    • OSCO noticed the OS license fee about the $100K each (Android and QNX) 
  • Sample 800pcs support on Feb ’23  
  • Chipset price for SA6155P and PMM6155AU
    • submitted the Auto compute pricing request template to Qualcomm Korea (7th Feb)

STATUS

• Under discussing the CESA agreement and NRE
  • kick-off meeting 12/15 (Qualcomm, SL and OSCO) 
• Completed the Kick-off meeting with HMC : 2022-11-15
• Submitted the SL requirement data for HKMC Build-in Cam to Qualcomm Korea (Sales, Marketing ,CE) (20-Dec) 
• Submitted the 3rd party sub-contractor request form to SL (20-Dec)
  • Submitted the feedback about object code/source code to Qualcomm (30th Jan 23) 
• Under preparing to make 2nd board (e/Mar, 100sets) 
  • Completed the 1st board 40 sets (e/Feb) 
• Under technical support
  • SL, OSCO and QCT 3-way conference call for specification review and confirmation.(Close)
  • PCB assembly schedule(Close)
    • Start of PCB fabrication.(1/12)
    • PCB assembly will be done 2/6 to 2/3.(Close)
    • Add 30-set PCB assembly with Samsung Non-PVL LPDDR.(Close)
  • Fail to boot when the system image is set to under 2GByte.(Close)
  • Configuration of PCM audio input.(Close)
  • How to be adding a CDT partition to eMMC.(Close)
  • 1’st Board Bring-up.(On-Going)
    • DDR training issue with 2-pcs/total 5-pcs board. (On-Going)
  • 2’nd PCB assembly schedule(On-Going)
    • 2’nd SCH/PCB modify. (Close)
    • Start of PCB fabrication due to second week in March.
    • Target PCB assembly will be done due to end of March.

STATUS

• Price table request based on yearly demand 
  • Due date : 5th Oct -> OSCO submitted the SA7255P + PMIC bundle price to MOBIS (10/14) 
    • Submitted the Quotation about QAM7255P (12GB, ‘AAAA’ softSKU) and QAM8255P (12GB, ‘CCCC’ softSKU), 18-Nov 2022
    • Submitted the QAM8255P 3rd quotation (6th Mar) 
• Issued ADP RIDE4.0 SX QAM8255P 1set (27th Feb)
  • SSD : 26th Apr, MOBIS CRD : within Mar, So, under pull-in the schedule        
• Issued sample PO 24pcs QAM8255P 36GB, CRD : 15th Mar 2023 (SSD : 15th Mar 2023) 
  • Mobis’s SMT schedule : 23rd Mar -> 28th Mar
    • OSCO submitted the 24pcs sample 22nd Mar to Mobis R&D 
  • Product list for candidate : SA8155P, QAM8155P, QAM8195P, QAM8255P etc. 
    • Submitted the EOL plan about SA8155P, QAM8155P, QAM8195P, QAM8255P (9th Feb 2023) 
      

STATUS

• Issued sample PO 24pcs QAM8650P (SSD : TBD) 
  • Target CRD : mid of Dec 2022 
  • Will review QAM8650P instead of QAM8540P 
    • delivered QAM8650P 24pcs to MOBIS R&D (12/9)
• Request the unit price about QAM8650P and QAM9000P 
  • Y2025 ~ Y2028 : 131,250 sets (set : QAM8650P x2ea / QAM9000P x1ea) 
  • Due date : 17th Feb 2023 
    • Submitted the budgetary price to MOBIS, 21st Feb (QAM8650P and QAM9000P)
      • QAM8650P “AAAA” 18GB AAT, QAM9000P “AB, 300TOPS” 16GB AAT 
    • issued 40pcs QAM8650P 36GB sample (28th Feb)
      • OSCO inventory - 40pcs
      • waiting for the MOBIS PO(Mobis will issue PO at Apr. 2023) 
        

STATUS

• Mobis China will be produced OV model of Digital Cluster 
• Under preparing the PV event (Dec, 2022) in Mobis China 
  • Submitted the 200pcs sample to Mobis China (22-Nov) 
• Completed the quotation same as digital cluster model
• Under preparing the Proto and PV event for OV model 
  • Will submit the 2Kpcs until Apr. 2023 to MOBIS Tianjin for Event 
• Support to MOBIS QC team for LPDDR test fail(On-Going) 
  • Inform the core clock and sub-block clock frequency.(Close)
  • Sheared an information to QCT CE team.(Close)

STATUS

• HW data has been delivered to the HW team and is under review. 
• Under reviewing the Thundercomm NDA and SLA 
• OSCO is under checking the Thundercomm HW data to Thundercomm.
• LGIT signed the Thundercomm NDA.
• LGIT is waiting for the Thundercomm HW release schedule.
• HW development outsourcing under review.
  • Three-way (LGIT, Thundercomm, OSCO) meeting is scheduled. (21st Oct : KST 10:00)
• OSCO is under checking the Thundercomm HW data to Thundercomm.
  • LGIT is waiting the Thundercomm release schedule (end of Oct)
• Without outsourcing, he will work directly on HW.
• Thundercomm's schematics are due out in mid-November.
• A quotation was submitted to purchase C7280 SoM 10pcs.
• C7280 SoM data for schematic and datasheet will be released within Nov 2022 by Thundercomm 
• LG IT will be issued the PO_SoM 5pcs.
• Thundercomm says that if you do not purchase the DK, it will not provide the SDK, so we are negotiating.
• Ordered for C7280 (8GB+256GB) SoM 5pcs. (12/19)
• Submitted the C7280 SoM datasheet and schematic data (27th Dec 2022)
• C7280 SoM delivery complete.(10th Jan)
• Request the conference call with Thundercomm about SLA (Software License Agreement).
• Checking issue for using Qualcomm Software.
  • Software license fee and SW function for development support
• Checking issue for using Qualcomm Software. (SC7280)
  • There is no file to proceed with the build.
  • Review request for sending raw images by bypassing from ISP.
• To support LGIT, Qualcomm and OSCO are scheduled to meet on 18th Jan. (in Qualcomm office)  
• Checking issue for using Qualcomm Software. (SC7280)
  • ISP, I2C, GPIO, Bring-up guide, CHI customization etc..
    • Awaiting response from Qualcomm.
    • Forwarded by checking Qualcomm answer. (document number format)
• Purchase order for Thundercom C7280 DK 1pcs (1/19)
• Under reviewing Thundercomm SLA.
  • Signed by LGIT and forwarded to Thundercomm.
• Raw data (10bit or 12bit) processing is required at the ISP level.
  • Contact Qualcomm because there is no explanation in SW Documents.
  • Additional Q&A in progress with Qualcomm.
  • Awaiting response from Qualcomm
• Thundercomm SW release.
• BoM review by HW Team.
• C7280 DK LCD requires separate purchase. (LGIT wants to rent)
  • Proceed to purchase.
• When checking Thundercomm SW, only binary was provided.
• Thundercomm DK & LCD SSD Schedule : 15th Mar
  • delivery complete(17th Mar)
• Request thundercomm documents for development

STATUS

• Seoul National University Bundang Hospital Specialized Network Project. (https://www.mdescort.net/)
• A Qualcomm Solution check was requested due to issues such as heat issue during development as an Intel Solution by an external partner of KT.
• After introducing Thundercomm Roadmap, interest in RB5 DK.
• INFOMARK is an introduction company and is considering purchasing Thundercomm RB5 DK through KT's other partners (not open).
• Issued PO 1 set RB5 DK from wheelie. (11/25)
• The RB5 DK shipping schedule has been updated for next week. (12/7)
• scheduled meeting. (12/1)
• RB5 DK will be tested by uploading the functions implemented in the Intel board. (~Jun 2023)
• The Thundercomm RB5 SDK has been downloaded, but the review process has not started.
• Field tests on Intel boards. 
  • At Seoul National University Bun-dang Hospital. (February 2023 - March 2023)
• Development on QRB5165 DK delayed.
• Under review T62G specification.
• Attaching T62G from QRB5165 is required. (Thundercomm support planned.)
• In order to test on QRB5165 DK, test is possible by connecting with T62G DK.
• Thundercomm plans to provide a driver to use T62G in RB5.
  • Meeting schedule: 3rd Mar
• KT + INFOMARK + Wheelie + Telstar-hommel (AMR wheelchair driving part)
• Review the T62 instead of the Wifi egg you are currently using.
• It is expected to start development in April or May after conducting field tests of existing products.

STATUS

• Additional product review under review. (500pcs ~ 2Kpcs)
  • Request a quote in increments of 500 for inventory control purposes.
• Process underway to purchase 1Kpcs.
• Quotation/Bid Progress. (C6125 SoM + SMB1355) 1Kpcs.
  • Open4U Quotation Bid Completed.
  • Waiting for Dreamus final confirmation.
    • Ordered from Thundercomm (C6125 SoM) & Qualcomm (SMB1355). (3/16) : CRD - 26th Jul
      

STATUS

• It is a project to develop an AICM(AI Computing Module) to be applied to a driving robot that can drive on public roads for Last-mile delivery by utilizing autonomous driving applications.
• This AICM will be developed to perform INT8 operation from 30 TOPS to 80 TOPS by grafting QRB5165 and External Scalable NPU.
• domestic market with V1.00 robots (Nvidia).
• American market in 2024 (Nvidia -> Qualcomm).
• Order for the following products (2/23)
  • Thundercomm RB6 DK 1pcs. (To review the QCS5165N)
  • Thundercomm RB5 DK 1pcs.
  • QCS5165N SOM 5pcs.
• Thundercomm SSD update
  • RB5 DK, QRB5165 SoM :15th Mar
    • RB5 Vision Kit arrived(17th Mar)
  • RB6 DK : 30th Mar
• Requested PKLA from Qualcomm to enable development with QRB5165N.
• Under reviewing for thundercomm documents.
  

STATUS

• An encryption module developer, reviewed as a 5G modem to be mounted on drones.
• Order for the following products (2/23)
  • Thundercomm T55G DK 2pcs.
  • SDX55 LGA SOM (T55G) 5pcs. 
• Quantum random number-based integrated encryption module for 5G communication.
• Control SDX55 module based on IP communication.
• It is necessary to confirm the "information system advancement project" reviewed by the government.
• Thundercomm SSD update
  • T55G DK, T55G SoM :15th Mar
    • delivery schedule delay
• Under reviewing for thundercomm SDK

STATUS

• Comparing specs for NVIDIA and RB6.
• Opinion that developers are familiar with TensorRT.
• Checking Q&A about RB6.
  • Check QRB5165N specifications and data.
• RB6 development meeting scheduled. (15th Mar)
  • Target Product Cost : $2,000
  • Request for qualcomm reference manual documents. (~ 24th Mar)
  • Checking availability and pricing for RB6 DK review. (70 TOPS vs 200 TOPS)
• RB6 (with 200 TOPS) is being reviewed for possible development.
  • No support plans on Thundercomm

STATUS

• Contact C6490 OS Support: Ubuntu (CS : Target date - Dec 2023)
• CT6490 (QCM6490) has no plans to support Ubuntu.
  • The CT6490 is not developed by Thundercomm
• Considering purchasing two C6490 DKs and 30pcs C6490 SOMs.
  

STATUS

• Through Zenith (PLC module manufacturer), PLC modules are purchased, and rapid chargers and slow chargers are manufactured and sold. (TI MCU + PLC) 
• The goal is to develop by adding the following 3 functions to the slow charger by Q1 in 2024 (it is difficult to implement with a PLC module)
  • User information authentication
  • Check charge information
  • Check charging speed information
• Regarding the specification, it can be reviewed at an industrial level. (QCA7000-AL3B)
• Competitor : Lumissil (IS31CG5317)
  • Lumissil company's PLC reviewed together
  • Lumissil products are advantageous because they are cheap.

STATUS

• On the Bidding
  • Competitor info – Airoha, AB1585
    • Concept 1 : QCC5181(BT intercom + ANC) + AB1565(Mesh intercom)
    • Concept 2 : QCC3024(BT intercom) + AB1585(Mesh intercom + ANC) : There is a high possibility of concet2's design win.(Model : Sports Touring-Helmet type)
    • Concept 3 : QCC5181(BT intercom + ANC) : The project is developed as a headset type
• Complete 1st mock-up sample
• OSCO delivered QCC5181 200pcs to SENA 01/18 week
• The PCB of the 2nd Field Test sample is being recreated.( Apply QCC5181 and fixed HW problem)
• SENA is planning a product as a BT intercom only model.(Concept3)
• Under testing Field test on 3/6week
• Under technical support    
  • Noise occurs in pairing mode.(Complete)
  • Power table applied firmware request.(Complete)

STATUS

• Completed PMP event
• Under preparing MP event(3/6 week)
  • Under Reliability testing in progress
• MP : by Mar
• Launch : early Apr or middle of Apr

STATUS

• Under Bidding 
  • Submitted final demo sample to YAMAHA(End of Dec’22)
• Bidding results are expected to come out in two weeks.(End of Jan’23)
  • 3Mic cVc Feature added, 2nd sample delivery scheduled (Target Schedule: March)
• Cresyn plan to deliver the 2nd sample on 3/13 Week.(2sets)
• Under technical support    
  • How to set up a 3-mic cVc microphone.(Checking)
  • Address where index is stored.(Checking)
  • Address where the connected device address is stored.(Checking)
  • Address where Link key is stored.(Checking)

STATUS

• Completed PMP event
• MP : 20th Mar
• Launch : early Apr
• Under technical support    
  • Ambient mode L, R balance is broken.(Complete)
  • BLE connection issue on Galaxy S22,S23.(Complete)

.STATUS

• Development schedule 
  • Mock-up sample schedule (DD -> LG, 서초 CTO) : early of Jul 
  • Development schedule finished : End of Oct, completed the PoC 
  • MP project (all schedule is delayed by 2~3 months because ECG sensor changed) 
    • DV1 : Apr Y22 -> end of Jun – 150 sets - Jul -> Sep 50 sets 
    • Field Demo : Sep -> Oct -> Sep 1.2K sets
    • DV2 : Aug -> Oct -> Dec’22150 sets
    • PV : Jul’22 -> early of Sep -> Oct  – 150 sets -> Nov -> Dec -> Jan’23, 150 sets  
    • MP : Sep Y22 -> Oct Y22 -> Nor Y22 -> Dec -> May’23 , 9.5K sets  
• Participated in CES under the name "brid.zzz".
• PP event started in the week of 1/2.
• Issued PO(24K-Mar’23, 20K-Apr’23)
• SIG Certification in progress
• MP : Early May
• Launch : End of May
• Under technical support    
  • Panic sometimes occurs when out of case.(Complete) #06530469
  • Failed in AVRCP item during SIG authentication.(Checking)
  • Question about A2DP connection error.(Checking)

.STATUS

• Issued PO License key for DV event(120pcs)
• Under preparing DV Event 
• Under preparing SIG Certification
• Under preparing aptX IOP test
• Under technical support
  • Unstable charger operation issue. (Checking) 

.STATUS

• Issued PO License key for DV event(170pcs)
• Under preparing DV Event
• Under preparing aptX IOP test 
• Under technical support
  • Support for power noise on 1V8_SMPS.(Checking)
  • A panic occurs during firmware update.(Checking)
  • SBC, AAC Codec I2S No output.(Checking)
  • UART RX not working.(Checking)
    

.STATUS

• Under preparing RFQ
  • Due date : TBD 
• Requirements 
  • HW Data for SA8155P and QAM8195P
  • OSCO submitted the data about STR mode, CPU spec, GPU spec/GFLPOS/APU TOPS for SA8150P (15th Mar)

.STATUS

• Quectel was used, but only KT was certified, so it was replaced with a Thundercomm product.
• This is the PoC stage, and the customer is going to produce about 5 units this year and proceed with the test.
• We would like to provide information about RB5 flight so that we can proceed with our review of the main solution.
• Conducted PO for 5pcs Thundercomm T55M SoM. à SSD: 16th Sep à delivery completed : 20th Sep
• T55 SoM module is being tested as a product.
• For T62G SoM, which has completed KT certification in 2022, SMATII is reviewing SPEC.
• Checking pricing information for T62G and T62M through Thundercomm.
• For the T62G, a quotation based on 100 is proposed.
• The purchase of 100 T62G is cancelled.
• About 5pcs of T62M SoM will be purchased and tested. But T62M is not carrier certified.
• Proceed to order the following products.
  • T62G 10pcs
  • T62M 10pcs
• Under review T62G/T62M SoM datasheet

.STATUS

• A specification table is being prepared, and a suitable chipset is being searched for.
• QCS6125 was recommended to support dual display. After checking the price information, we are preparing a proposal to quber.
• The unit price was delivered to Quber, and the QCS-6125 Datasheet is being reviewed.
• BARROT HW (LGDISPLAY) + Jargon Terminology Deep Learning Module (RSN) + Azure (Microsoft).
• Reviewing product specifications.
• QCS6125 and QCS8250 board quotations were submitted by QUBER at LGD's request. 
• The difference between the two products is about 30-40%. (QCS6125 Board vs QCS8250 Board)
• There was an NDA request to Qualcomm from LGDISPLAY. (LGD Reviewing)
• Under reviewing the feature about QCS8250 and QCS6125 (BOM cost).
• Thinking about how to distinguish the voices of various speakers on the QCS8250.
• Requesting Qualcomm for reference speech recognition data on the QCS8250.
• Collaboration system materials forwarded to QUBER for review.
• Model transferred to Div. from TFT project
• The Pilot Board is delivered to Microsoft for review. (by LGD)
  • Jan 2023, Rockchip board version (Maker : China's 3rd party) 
  • Quber will make the event sample from next step. (event schedule is TBD, Quber is discussing the development schedule with LGD)
• QUBER awaits two decisions below.
  • Specification confirmed after Microsoft's review. (~ end of Jan)
  • To decide the chipset (6125 or 8250) by LG Display.
• It is highly likely that the decision will be made with the QCS8250, and the board configuration will be shared with the Coway Project.
• LGDISPLAY awaits review from Microsoft. (need more time)
• Internal report regarding LGD's internal business review is in progress. 
  • Expect development schedule delay.
• After the internal organizational reorganization after the task team, projects are being reviewed.
• Quber awaits a response from LGD. (Maybe expected in early March)
• Microsoft's reaction to the concept was good.
• It was dropped due to the part where AI translation core technology was included in Microsoft and LG Display's business reasons.

.STATUS

• Authorized Design Center (ADC) registration review.
• Review proposals for funding.
  • Cost & FCST
• Because the timing of development is critical, Quber requested a quick review from Qualcomm HQ to begin development.
• In QUBER, it is difficult to proceed with the project in a situation where Qualcomm Funding has not been carried out.
• BOM cost Due to price competitiveness, Quber is developing products with Rockchip.

.STATUS

• Ordered one additional T55M 5G DK Package.
• Delivered 2pcs RB5 DK (9/14) 
• It will be submitted to the US exhibition (Korea-US Startup Forum).
• Requested to purchase 2 more RB5 Vision Kit (with Camera).
• Under checking sample demand and schedule for the event
• OSCO delivered 5G-Mezz Package 1pcs to Argosdyne. (10/14)
• OSCO delivered RB5 Vision Kit 2pcs to Argosdyne. (10/25)
• Argosdyne is preparing a demonstration for Naver with a target in Dec Y22.
• To review the camera features, they purchased the DK with the Camera.
• Ordered QRB5165 SoM 5pcs for ES Board. (2/1)
  • Thundercomm SSD : 30th Mar
• Modify the 1st ES board to proceed with the 2nd ES board. (8th Mar)
• Additional long-range wifi products under review.